GEO News & Events

 

04Jun

GEO Semiconductor Grants eyevis License to Certain Patented eWARP™ Technologies

June 4, 2013, Santa Clara, CA and Reutlingen, Germany – GEO Semiconductor Inc. (GEO), a leading developer of geometric processor and H.264 CODEC IC solutions, and eyevis Gesellschafft für Projektions- und Großbildtechnik mbH (eyevis), a leader in large screen projection systems, jointly announced today that they have amicably entered into a licensing agreement.
29Apr

GEO Semi Announces New Board Member and Appointment of Three Executives

Santa Clara, CA - April 29 2013 - GEO Semiconductor Inc. ("GEO"), the industry leader in high performance, programmable geometric processing, compression and video processing solutions, today announced that David Orton, formerly CEO of ATI Technologies and Aptina, has joined the GEO board of directors.
16Apr

GEO Semiconductor Completes $13 Million in Additional Equity Funding

Santa Clara, CA - April 16, 2013 - GEO Semiconductor Inc. ("GEO"), the industry leader in high performance, geometric processing and CODEC video processing solutions, today announced that it has completed a $13 million funding consisting of convertible debt and preferred equity financing from existing and new shareholders, including Panasonic Corporation.
10Apr

International Security Conference (ISC-West) 2013 Invitation

April 10th – 12th, 2013, Las Vegas, Nevada Advanced Technology Demos from GEO Semiconductor Inc. and the recently acquired Video Processing Division of Maxim Integrated Products. GEO Semiconductor is pleased to invite you to an exclusive demonstration of the capabilities of the eWARP™ platform and the state-of-the-art “Mobilygen” H.264 Video Compression solutions at the International […]
08Jan

Consumer Electronics Show 2013

January 8th – 11th, 2013, Las Vegas, Nevada Advanced Technology Demos from GEO Semiconductor and the recently acquired Video Processing Division of Maxim Integrated Products. GEO Semiconductor is pleased to invite you to an exclusive demonstration of the capabilities of the eWARP™ platform and the state-of-the-art “Mobilygen” H.264 Video Compression solutions at the Consumer Electronics […]
03Jan

GEO Semiconductor Completes Acquisition of Maxim Integrated’s Digital Video Processing Business

Santa Clara CA – January 3, 2013 - GEO Semiconductor Inc. ("GEO"), the industry leader in high performance, geometric processing solutions and inventor of the “eWARP™” technology platform, announced today that it has completed the acquisition of the digital video processing business from Maxim Integrated Products, Inc. (NASDAQ:MXIM).
06Dec

GEO Semiconductor to Acquire Maxim Integrated’s Digital Video Processing Business

Santa Clara CA – December 6, 2012 - GEO Semiconductor Inc. ("GEO"), the industry leader in high performance, geometric processing solutions and inventor of the “eWARP™” technology platform, announced today that it has entered into an agreement to acquire the digital video processing business from Maxim Integrated Products, Inc. (NASDAQ:MXIM).
16Oct

SAE Convergence 2012

October 16th – 17th, 2012, Detroit, Michigan Invitation to demonstrations of GEO Semiconductor’s eWARP™ Platform de-warping wide angle lenses, auto calibration of camera systems and distortion correction for Heads Up displays (HUDs). GEO is pleased to invite you to an exclusive demonstration of the capabilities of its eWARP™ chip at SAE Convergence 2012 at the […]
15Jun

GEO Semiconductor Inc. Announces Channel Partnership with Ascendtek, Inc.

Santa Clara, CA, June 15, 2012 - GEO Semiconductor Inc. ("GEO"), the industry leader in programmable, high performance, geometric processor (eWARP™) IC solutions for smartphones & peripherals, video communications, surveillance, wearable and automotive video camera markets, today announced that it has entered into a channel partnership with Ascendtek Inc.
11Jun

GEO Semiconductor Secures $3 Million in Debt Financing – Converts into Series B

Santa Clara CA – June 11, 2012 - GEO Semiconductor Inc. ("GEO"), the industry leader in programmable, high performance, geometric processor (eWARP™) IC solutions for smartphones & peripherals, video communications, surveillance, wearable and automotive video camera markets, today announced that it has secured $3 million in debt financing, which converts into Series B equity when a certain threshold is achieved.

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